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    Influences of Additives on Electroless Copper Plating in Tetrahydroxypropyl Ethylenediamine - Disodium Ethylene Diamine Tetraacetic Acetate Bath

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    Influences of Additives on Electroless Copper Plating in Tetrahydroxypropyl Ethylenediamine - Disodium Ethylene Diamine Tetraacetic Acetate Bath

    New search for: Cao, Quan-gen
    New search for: Chen, Shi-rong
    New search for: Yang, Qiong
    New search for: Wang, Hao
    New search for: Xie, Jin-ping
    New search for: Fan, Xiao-ling

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influences of Additives on Electroless Copper Plating in Tetrahydroxypropyl Ethylenediamine - Disodium Ethylene Diamine Tetraacetic Acetate Bath

    New search for: Cao, Quan-gen
    New search for: Chen, Shi-rong
    New search for: Yang, Qiong
    New search for: Wang, Hao
    New search for: Xie, Jin-ping
    New search for: Fan, Xiao-ling

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Influences of Additives on Electroless Copper Plating in Tetrahydroxypropyl Ethylenediamine - Disodium Ethylene Diamine Tetraacetic Acetate Bath

    Contributors:

    Cao, Quan-gen (author) / Chen, Shi-rong (author) / Yang, Qiong (author) / Wang, Hao (author) / Xie, Jin-ping (author) / Fan, Xiao-ling (author)

    Published in:

    Cai liao bao hu = ; 48 ; 05-08

    Publication date:

    2015-01-01

    Size:

    4 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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