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    Effects of additives and chelating agents on electroless copper plating

    New search for: Lin, Y. M.
    New search for: Yen, S. C.

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    Effects of additives and chelating agents on electroless copper plating

    New search for: Lin, Y. M.
    New search for: Yen, S. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of additives and chelating agents on electroless copper plating

    New search for: Lin, Y. M.
    New search for: Yen, S. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Effects of additives and chelating agents on electroless copper plating

    Contributors:

    Lin, Y. M. (author) / Yen, S. C. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 178 ; 116-126

    Publication date:

    2001-01-01

    Size:

    11 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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