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    Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste

    New search for: Ogura, Tomo
    New search for: Takata, Shinya
    New search for: Takahashi, Makoto
    New search for: Hirose, Akio

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    Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste

    New search for: Ogura, Tomo
    New search for: Takata, Shinya
    New search for: Takahashi, Makoto
    New search for: Hirose, Akio

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste

    New search for: Ogura, Tomo
    New search for: Takata, Shinya
    New search for: Takahashi, Makoto
    New search for: Hirose, Akio

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste

    Contributors:

    Ogura, Tomo (author) / Takata, Shinya (author) / Takahashi, Makoto (author) / Hirose, Akio (author)

    Published in:

    Materials transactions ; 56 ; 1030-1036

    Publication date:

    2015-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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