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Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste
Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste
Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste
Ogura, Tomo (Autor:in) / Takata, Shinya (Autor:in) / Takahashi, Makoto (Autor:in) / Hirose, Akio (Autor:in)
Materials transactions ; 56 ; 1030-1036
01.01.2015
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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