A platform for research: civil engineering, architecture and urbanism
Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel
Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel
Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel
Harumoto, Takashi (author) / Ohashi, Osamu (author) / Tsushima, Hiroki (author) / Narui, Miho (author) / Aihara, Kensaku (author) / Ishiguro, Takashi (author)
Materials transactions ; 56 ; 1683-1687
2015-01-01
5 pages
Article (Journal)
English
DDC:
620.1105
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Diffusion Bonding of Austenitic Stainless Steel 316L to a Magnesium Alloy
British Library Online Contents | 2010
|Mechanical Performances and Failure Modes of Direct Diffusion Bonding Joints of 316L Stainless Steel
British Library Online Contents | 2006
|Finite-Element Modeling of Stress-Assisted Hydrogen Diffusion in 316L Stainless Steel
British Library Online Contents | 1998
|British Library Online Contents | 2002
|Technique of Chromium-Free Passivation of 316L Stainless Steel
British Library Online Contents | 2001
|