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    Change in Electrical Resistivity of Pure Cu Processed by Accumulative Roll Bonding

    New search for: Miyajima, Yoji
    New search for: Shinohara, Takahiko
    New search for: Adachi, Hiroki
    New search for: Fujii, Toshiyuki
    New search for: Onaka, Susumu
    New search for: Kato, Masaharu

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    Change in Electrical Resistivity of Pure Cu Processed by Accumulative Roll Bonding

    New search for: Miyajima, Yoji
    New search for: Shinohara, Takahiko
    New search for: Adachi, Hiroki
    New search for: Fujii, Toshiyuki
    New search for: Onaka, Susumu
    New search for: Kato, Masaharu

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Change in Electrical Resistivity of Pure Cu Processed by Accumulative Roll Bonding

    New search for: Miyajima, Yoji
    New search for: Shinohara, Takahiko
    New search for: Adachi, Hiroki
    New search for: Fujii, Toshiyuki
    New search for: Onaka, Susumu
    New search for: Kato, Masaharu

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Change in Electrical Resistivity of Pure Cu Processed by Accumulative Roll Bonding

    Contributors:

    Miyajima, Yoji (author) / Shinohara, Takahiko (author) / Adachi, Hiroki (author) / Fujii, Toshiyuki (author) / Onaka, Susumu (author) / Kato, Masaharu (author)

    Published in:

    Materials transactions ; 59 ; 393-398

    Publication date:

    2018-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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