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    Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

    New search for: Akbari, Saeed
    New search for: Nourani, Amir
    New search for: Spelt, Jan K.

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    Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

    New search for: Akbari, Saeed
    New search for: Nourani, Amir
    New search for: Spelt, Jan K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

    New search for: Akbari, Saeed
    New search for: Nourani, Amir
    New search for: Spelt, Jan K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling

    Contributors:

    Akbari, Saeed (author) / Nourani, Amir (author) / Spelt, Jan K. (author)

    Published in:

    Composites.Part A, Applied science and manufacturing ; 88 ; 178-189

    Publication date:

    2016-01-01

    Size:

    12 pages

    ISSN:

    1359-835X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11805

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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