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Stress-induced trench narrowing in Cu interconnect of sub-20nm node: FEM simulation

Kim, Dong-Hyun / Mhin, Sung-Wook / Byun, Myung-Hwan

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Stress-induced trench narrowing in Cu interconnect of sub-20nm node: FEM simulation

Kim, Dong-Hyun / Mhin, Sung-Wook / Byun, Myung-Hwan

Stress-induced trench narrowing in Cu interconnect of sub-20nm node: FEM simulation

Kim, Dong-Hyun / Mhin, Sung-Wook / Byun, Myung-Hwan

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Stress-induced trench narrowing in Cu interconnect of sub-20nm node: FEM simulation

Contributors:

Kim, Dong-Hyun (author) / Mhin, Sung-Wook (author) / Byun, Myung-Hwan (author)

Published in:

Materials science in semiconductor processing ; 56 ; 100-105

Publication date:

2016-01-01

Size:

6 pages

ISSN:

1369-8001

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.38152

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