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    A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

    New search for: Wang, Peizhi
    New search for: Ge, Peiqi
    New search for: Li, Zongqiang
    New search for: Ge, Mengran
    New search for: Gao, Yufei

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    A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

    New search for: Wang, Peizhi
    New search for: Ge, Peiqi
    New search for: Li, Zongqiang
    New search for: Ge, Mengran
    New search for: Gao, Yufei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

    New search for: Wang, Peizhi
    New search for: Ge, Peiqi
    New search for: Li, Zongqiang
    New search for: Ge, Mengran
    New search for: Gao, Yufei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

    Contributors:

    Wang, Peizhi (author) / Ge, Peiqi (author) / Li, Zongqiang (author) / Ge, Mengran (author) / Gao, Yufei (author)

    Published in:

    Materials science in semiconductor processing ; 68 ; 21-29

    Publication date:

    2017-01-01

    Size:

    9 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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