Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC
A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC
A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC
Wang, Peizhi (Autor:in) / Ge, Peiqi (Autor:in) / Li, Zongqiang (Autor:in) / Ge, Mengran (Autor:in) / Gao, Yufei (Autor:in)
Materials science in semiconductor processing ; 68 ; 21-29
01.01.2017
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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