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Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Azar, Amin S. (author) / Holme, Børge (author) / Nielsen, Øyvind (author)
Engineering fracture mechanics ; 154 ; 262-271
2016-01-01
10 pages
Article (Journal)
English
DDC:
620.112605
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