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    Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

    New search for: Liu, Tengyun
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Gao, Yufei

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    Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

    New search for: Liu, Tengyun
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Gao, Yufei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

    New search for: Liu, Tengyun
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Gao, Yufei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

    Contributors:

    Liu, Tengyun (author) / Ge, Peiqi (author) / Bi, Wenbo (author) / Gao, Yufei (author)

    Published in:

    Materials science in semiconductor processing ; 57 ; 147-156

    Publication date:

    2017-01-01

    Size:

    10 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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