A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Demonstration of sub 150°C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer
Demonstration of sub 150°C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer
Demonstration of sub 150°C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer
Panigrahi, Asisa Kumar (author) / Ghosh, Tamal (author) / Vanjari, Siva Rama Krishna (author) / Singh, Shiv Govind (author)
MATERIALS LETTERS ; 194 ; 86-89
2017-01-01
4 pages
Article (Journal)
Unknown
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Multi-layer composite board and thermocompression bonding processing method thereof
| European Patent Office | 2023
Surface passivation of GaAs by ultra-thin cubic GaN layer
| British Library Online Contents | 2000
Nanometer copper cylinder thermocompression bonding process
| European Patent Office | 2023
GaAs surface passivation by ultra-thin epitaxial GaP layer and surface As-P exchange
| British Library Online Contents | 2007
Silicon surface passivation using thin HfO2 films by atomic layer deposition
| British Library Online Contents | 2015