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    Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    New search for: Chen, Jin-Ju
    New search for: Lin, Guo-Qiang
    New search for: Wang, Yan
    New search for: Sowade, Enrico
    New search for: Baumann, Reinhard R.
    New search for: Feng, Zhe-Sheng

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    Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    New search for: Chen, Jin-Ju
    New search for: Lin, Guo-Qiang
    New search for: Wang, Yan
    New search for: Sowade, Enrico
    New search for: Baumann, Reinhard R.
    New search for: Feng, Zhe-Sheng

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    New search for: Chen, Jin-Ju
    New search for: Lin, Guo-Qiang
    New search for: Wang, Yan
    New search for: Sowade, Enrico
    New search for: Baumann, Reinhard R.
    New search for: Feng, Zhe-Sheng

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

    Contributors:

    Chen, Jin-Ju (author) / Lin, Guo-Qiang (author) / Wang, Yan (author) / Sowade, Enrico (author) / Baumann, Reinhard R. (author) / Feng, Zhe-Sheng (author)

    Published in:

    Applied surface science ; 396 ; 202-207

    Publication date:

    2017-01-01

    Size:

    6 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.44

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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