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Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Chen, Jin-Ju (Autor:in) / Lin, Guo-Qiang (Autor:in) / Wang, Yan (Autor:in) / Sowade, Enrico (Autor:in) / Baumann, Reinhard R. (Autor:in) / Feng, Zhe-Sheng (Autor:in)
Applied surface science ; 396 ; 202-207
01.01.2017
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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