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    Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

    New search for: Shi, Junqin
    New search for: Chen, Juan
    New search for: Fang, Liang
    New search for: Sun, Kun
    New search for: Sun, Jiapeng
    New search for: Han, Jing

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    Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

    New search for: Shi, Junqin
    New search for: Chen, Juan
    New search for: Fang, Liang
    New search for: Sun, Kun
    New search for: Sun, Jiapeng
    New search for: Han, Jing

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

    New search for: Shi, Junqin
    New search for: Chen, Juan
    New search for: Fang, Liang
    New search for: Sun, Kun
    New search for: Sun, Jiapeng
    New search for: Han, Jing

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

    Contributors:

    Shi, Junqin (author) / Chen, Juan (author) / Fang, Liang (author) / Sun, Kun (author) / Sun, Jiapeng (author) / Han, Jing (author)

    Published in:

    Applied surface science ; 435 ; 983-992

    Publication date:

    2018-01-01

    Size:

    10 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.44

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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