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    Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

    New search for: Akbari, Saeed
    New search for: Nourani, Amir
    New search for: Spelt, Jan K.

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    Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

    New search for: Akbari, Saeed
    New search for: Nourani, Amir
    New search for: Spelt, Jan K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

    New search for: Akbari, Saeed
    New search for: Nourani, Amir
    New search for: Spelt, Jan K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

    Contributors:

    Akbari, Saeed (author) / Nourani, Amir (author) / Spelt, Jan K. (author)

    Published in:

    Engineering fracture mechanics ; 187 ; 225-240

    Publication date:

    2018-01-01

    Size:

    16 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112605

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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