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    Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide

    New search for: Wang, Peizhi
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Ge, Mengran
    New search for: Liu, Tengyun

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    Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide

    New search for: Wang, Peizhi
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Ge, Mengran
    New search for: Liu, Tengyun

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide

    New search for: Wang, Peizhi
    New search for: Ge, Peiqi
    New search for: Bi, Wenbo
    New search for: Ge, Mengran
    New search for: Liu, Tengyun

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide

    Contributors:

    Wang, Peizhi (author) / Ge, Peiqi (author) / Bi, Wenbo (author) / Ge, Mengran (author) / Liu, Tengyun (author)

    Published in:

    Engineering fracture mechanics ; 184 ; 273-285

    Publication date:

    2017-01-01

    Size:

    13 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112605

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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