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Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling
Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling
Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling
Yan, X.L. (author) / Liu, Y. (author) / Swart, H.C. (author) / Wang, J.Y. (author) / Terblans, J.J. (author)
Applied surface science ; 364 ; 567-572
2016-01-01
6 pages
Article (Journal)
English
DDC:
620.44
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