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Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling
Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling
Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling
Yan, X.L. (Autor:in) / Liu, Y. (Autor:in) / Swart, H.C. (Autor:in) / Wang, J.Y. (Autor:in) / Terblans, J.J. (Autor:in)
Applied surface science ; 364 ; 567-572
01.01.2016
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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