Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Enhanced adhesion of polypropylene to copper substrates

    New search for: Brostow, Witold
    New search for: Chen, I. Kang
    New search for: Hnatchuk, Nathalie
    New search for: Hrbacek, Justin
    New search for: Hull, Andrew
    New search for: Pahler, Raymond H.
    New search for: Srinivasan, Ajay

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Enhanced adhesion of polypropylene to copper substrates

    New search for: Brostow, Witold
    New search for: Chen, I. Kang
    New search for: Hnatchuk, Nathalie
    New search for: Hrbacek, Justin
    New search for: Hull, Andrew
    New search for: Pahler, Raymond H.
    New search for: Srinivasan, Ajay

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Enhanced adhesion of polypropylene to copper substrates

    New search for: Brostow, Witold
    New search for: Chen, I. Kang
    New search for: Hnatchuk, Nathalie
    New search for: Hrbacek, Justin
    New search for: Hull, Andrew
    New search for: Pahler, Raymond H.
    New search for: Srinivasan, Ajay

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Enhanced adhesion of polypropylene to copper substrates

    Contributors:

    Brostow, Witold (author) / Chen, I. Kang (author) / Hnatchuk, Nathalie (author) / Hrbacek, Justin (author) / Hull, Andrew (author) / Pahler, Raymond H. (author) / Srinivasan, Ajay (author)

    Published in:

    Polymer testing ; 63 ; 158-162

    Publication date:

    2017-01-01

    Size:

    5 pages

    ISSN:

    0142-9418

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1920287

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Enhanced adhesion of polypropylene to copper substrates

    Brostow, Witold / Chen, I. Kang / Hnatchuk, Nathalie et al. | British Library Online Contents | 2017

    Improvement of adhesion properties of polypropylene substrates by methyl methacrylate UV photografting surface treatment

    Balart, J. / Fombuena, V. / Espana, J.M. et al. | British Library Online Contents | 2012

    Improvement of adhesion properties of polypropylene substrates by methyl methacrylate UV photografting surface treatment

    Balart, J. / Fombuena, V. / España, J.M. et al. | Elsevier | 2011

    Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates

    Okamoto, N. / Wang, F. / Watanabe, T. | British Library Online Contents | 2004

    Adhesion Mechanisms in Woodfiber-Polypropylene Composites

    Kazayawoko, M. / Balatinecz, J. J. / United States; Forest Service et al. | British Library Conference Proceedings | 1997

    Back to top