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Enhanced adhesion of polypropylene to copper substrates
Enhanced adhesion of polypropylene to copper substrates
Enhanced adhesion of polypropylene to copper substrates
Brostow, Witold (Autor:in) / Chen, I. Kang (Autor:in) / Hnatchuk, Nathalie (Autor:in) / Hrbacek, Justin (Autor:in) / Hull, Andrew (Autor:in) / Pahler, Raymond H. (Autor:in) / Srinivasan, Ajay (Autor:in)
Polymer testing ; 63 ; 158-162
01.01.2017
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1920287
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Enhanced adhesion of polypropylene to copper substrates
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