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Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer
Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer
Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer
Wang, Luhua (author) / Li, Jianwei (author) / Catalano, Massimo (author) / Bai, Guangzhu (author) / Li, Ning (author) / Dai, Jingjie (author) / Wang, Xitao (author) / Zhang, Hailong (author) / Wang, Jinguo (author) / Kim, Moon J. (author)
Composites.Part A, Applied science and manufacturing ; 113 ; 76-82
2018-01-01
7 pages
Article (Journal)
English
DDC:
620.11805
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