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    A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce, Ga) alloy filler

    New search for: Cheng, L.X.
    New search for: Li, G.Y.
    New search for: Wang, X.Q.
    New search for: Li, Z.L.
    New search for: Wu, Z.Z.

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    A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce, Ga) alloy filler

    New search for: Cheng, L.X.
    New search for: Li, G.Y.
    New search for: Wang, X.Q.
    New search for: Li, Z.L.
    New search for: Wu, Z.Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce, Ga) alloy filler

    New search for: Cheng, L.X.
    New search for: Li, G.Y.
    New search for: Wang, X.Q.
    New search for: Li, Z.L.
    New search for: Wu, Z.Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce, Ga) alloy filler

    Contributors:

    Cheng, L.X. (author) / Li, G.Y. (author) / Wang, X.Q. (author) / Li, Z.L. (author) / Wu, Z.Z. (author)

    Published in:

    MATERIALS LETTERS ; 165 ; 103-106

    Publication date:

    2016-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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