Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler: Fid-Bau Portal

Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

Cheng, L.X. / Liu, M.R. / Wang, X.Q. / Yan, B.H. / Li, G.Y.

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Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

Cheng, L.X. / Liu, M.R. / Wang, X.Q. / Yan, B.H. / Li, G.Y.

Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

Cheng, L.X. / Liu, M.R. / Wang, X.Q. / Yan, B.H. / Li, G.Y.

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Check availability in my library

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Document information

Title:

Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

Contributors:

Cheng, L.X. (author) / Liu, M.R. (author) / Wang, X.Q. (author) / Yan, B.H. (author) / Li, G.Y. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 680 ; 317-323

Publication date:

2017-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Cheng, L.X. / Li, G.Y. / Wang, X.Q. et al. | British Library Online Contents | 2016

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Tomlinson, W. J. / Fullylove, A. | British Library Online Contents | 1992

Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints

Kar, A. / Ghosh, M. / Majumdar, B.S. et al. | British Library Online Contents | 2007

Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

Kim, K. S. / Suganuma, K. / Shimozaki, T. et al. | British Library Online Contents | 2003