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    Effects of thermal residual stresses and thermal-induced geometrically necessary dislocations on size-dependent strengthening of particle-reinforced MMCs

    New search for: Cao, Dongfeng
    New search for: Duan, Qingfeng
    New search for: Li, Shuxin
    New search for: Zhong, Yucheng
    New search for: Hu, Haixiao

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    Effects of thermal residual stresses and thermal-induced geometrically necessary dislocations on size-dependent strengthening of particle-reinforced MMCs

    New search for: Cao, Dongfeng
    New search for: Duan, Qingfeng
    New search for: Li, Shuxin
    New search for: Zhong, Yucheng
    New search for: Hu, Haixiao

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of thermal residual stresses and thermal-induced geometrically necessary dislocations on size-dependent strengthening of particle-reinforced MMCs

    New search for: Cao, Dongfeng
    New search for: Duan, Qingfeng
    New search for: Li, Shuxin
    New search for: Zhong, Yucheng
    New search for: Hu, Haixiao

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effects of thermal residual stresses and thermal-induced geometrically necessary dislocations on size-dependent strengthening of particle-reinforced MMCs

    Contributors:

    Cao, Dongfeng (author) / Duan, Qingfeng (author) / Li, Shuxin (author) / Zhong, Yucheng (author) / Hu, Haixiao (author)

    Published in:

    Composite structures ; 200 ; 290-297

    Publication date:

    2018-01-01

    Size:

    8 pages

    ISSN:

    0263-8223

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  624.18

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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