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Diffusion behavior at void tip and its contributions to void shrinkage during solid-state bonding

Zhang, C. / Li, M.Q. / Li, H.

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Diffusion behavior at void tip and its contributions to void shrinkage during solid-state bonding

Zhang, C. / Li, M.Q. / Li, H.

Diffusion behavior at void tip and its contributions to void shrinkage during solid-state bonding

Zhang, C. / Li, M.Q. / Li, H.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Diffusion behavior at void tip and its contributions to void shrinkage during solid-state bonding

Contributors:

Zhang, C. (author) / Li, M.Q. (author) / Li, H. (author)

Published in:

Journal of materials science & technology ; 34 ; 1449-1454

Publication date:

2018-01-01

Size:

6 pages

ISSN:

1005-0302

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105

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