Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers: Fid-Bau Portal

Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Bogan, J. / Brady-Boyd, A. / Armini, S. / Lundy, R. / Selvaraju, V. / O'Connor, R.

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Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Bogan, J. / Brady-Boyd, A. / Armini, S. / Lundy, R. / Selvaraju, V. / O'Connor, R.

Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Bogan, J. / Brady-Boyd, A. / Armini, S. / Lundy, R. / Selvaraju, V. / O'Connor, R.

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Check availability in my library

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Document information

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Document information

Title:

Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Contributors:

Bogan, J. (author) / Brady-Boyd, A. (author) / Armini, S. (author) / Lundy, R. (author) / Selvaraju, V. (author) / O'Connor, R. (author)

Published in:

Applied surface science ; 462 ; 38-47

Publication date:

2018-01-01

Size:

10 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.44

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