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    Effect of hydrogen addition on diffusion bonding behavior of Ti-55 alloy

    New search for: Wu, Huiping
    New search for: Peng, Heli
    New search for: Li, Xifeng
    New search for: Chen, Jun

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    Effect of hydrogen addition on diffusion bonding behavior of Ti-55 alloy

    New search for: Wu, Huiping
    New search for: Peng, Heli
    New search for: Li, Xifeng
    New search for: Chen, Jun

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of hydrogen addition on diffusion bonding behavior of Ti-55 alloy

    New search for: Wu, Huiping
    New search for: Peng, Heli
    New search for: Li, Xifeng
    New search for: Chen, Jun

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of hydrogen addition on diffusion bonding behavior of Ti-55 alloy

    Contributors:

    Wu, Huiping (author) / Peng, Heli (author) / Li, Xifeng (author) / Chen, Jun (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 739 ; 244-253

    Publication date:

    2019-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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