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    Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

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    New search for: Nam, Ki-Ho
    New search for: Lee, Sangrae
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    Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

    New search for: Seo, Kwangwon
    New search for: Nam, Ki-Ho
    New search for: Lee, Sangrae
    New search for: Han, Haksoo

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

    New search for: Seo, Kwangwon
    New search for: Nam, Ki-Ho
    New search for: Lee, Sangrae
    New search for: Han, Haksoo

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Polyimide/organosilicate nanocomposites: Residual stress behavior on Si wafer for multichip packaging

    Contributors:

    Seo, Kwangwon (author) / Nam, Ki-Ho (author) / Lee, Sangrae (author) / Han, Haksoo (author)

    Published in:

    MATERIALS LETTERS ; 247 ; 171-173

    Publication date:

    2019-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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