A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Transferencia de calor en una lámpara led tipo bulbo
This article compares the lifetime, operating temperature, electronic component condition and electronic board condition of three LED lamps. In the first focus, no thermal paste was applied. In the second focus, thermal paste was applied only on the contact surface of the LED chip card and the heatsink. In the third focus, thermal paste was applied in and around the contact zone, generating a larger contact surface. It was observed that, in the third focus, the thermal paste applied in and around the contact surface optimizes heat transfer to the heatsink.
Transferencia de calor en una lámpara led tipo bulbo
This article compares the lifetime, operating temperature, electronic component condition and electronic board condition of three LED lamps. In the first focus, no thermal paste was applied. In the second focus, thermal paste was applied only on the contact surface of the LED chip card and the heatsink. In the third focus, thermal paste was applied in and around the contact zone, generating a larger contact surface. It was observed that, in the third focus, the thermal paste applied in and around the contact surface optimizes heat transfer to the heatsink.
Transferencia de calor en una lámpara led tipo bulbo
Antonio Mendoza Guillén (author)
2021
Article (Journal)
Electronic Resource
Unknown
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