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Power consumption benchmark for a semiconductor cleanroom facility system
AbstractBenchmarking is an important step in implementing energy conservation in a semiconductor fabrication plant (hereafter referred to as “fab”). A semiconductor cleanroom facility system is complicated, usually comprised of several sub-systems, such as a chilled water system, a make-up system, an exhaust air system, a compressed air system, a process cooling water (PCW) system, a nitrogen system, a vacuum system, and an ultra-pure water (UPW) system. It is a daunting task to allocate energy consumption and determine an optimum benchmark. This study aims to establish the energy benchmark of a typical 8-in. DRAM semiconductor fab through field measurement data. Results of the measured energy consumption index were: chilled water system (including chiller, chilled water pump and cooling tower): 0.257kW/kW (=0.9kW/RT) in summer and 0.245kW/kW (=0.86kW/RT) in winter air recirculation air system: 0.00018kWh/m3 make-up air system: 0.0042kWh/m3 general exhaust air system: 0.0007kWh/m3 solvent exhaust air system: 0.0021kWh/m3 acid exhaust air system: 0.0009kWh/m3 alkaline exhaust air system: 0.0025kWh/m3 nitrogen system: 0.2209kWh/m3 compressed dry air system: 0.2250kWh/m3 process cooling water system: 1.3535kWh/m3 and ultra-pure water system: 9.5502kWh/m3. These data can be used to assess the efficiency of different energy-saving schemes and as a good reference for factory authorities. The PCW system's status before and after implementing energy conservation is discussed.
Power consumption benchmark for a semiconductor cleanroom facility system
AbstractBenchmarking is an important step in implementing energy conservation in a semiconductor fabrication plant (hereafter referred to as “fab”). A semiconductor cleanroom facility system is complicated, usually comprised of several sub-systems, such as a chilled water system, a make-up system, an exhaust air system, a compressed air system, a process cooling water (PCW) system, a nitrogen system, a vacuum system, and an ultra-pure water (UPW) system. It is a daunting task to allocate energy consumption and determine an optimum benchmark. This study aims to establish the energy benchmark of a typical 8-in. DRAM semiconductor fab through field measurement data. Results of the measured energy consumption index were: chilled water system (including chiller, chilled water pump and cooling tower): 0.257kW/kW (=0.9kW/RT) in summer and 0.245kW/kW (=0.86kW/RT) in winter air recirculation air system: 0.00018kWh/m3 make-up air system: 0.0042kWh/m3 general exhaust air system: 0.0007kWh/m3 solvent exhaust air system: 0.0021kWh/m3 acid exhaust air system: 0.0009kWh/m3 alkaline exhaust air system: 0.0025kWh/m3 nitrogen system: 0.2209kWh/m3 compressed dry air system: 0.2250kWh/m3 process cooling water system: 1.3535kWh/m3 and ultra-pure water system: 9.5502kWh/m3. These data can be used to assess the efficiency of different energy-saving schemes and as a good reference for factory authorities. The PCW system's status before and after implementing energy conservation is discussed.
Power consumption benchmark for a semiconductor cleanroom facility system
Hu, Shih-Cheng (author) / Wu, Jen-Syua (author) / Chan, David Yih-Liang (author) / Hsu, Rich Tsung-Chi (author) / Lee, Jane Car-Cheng (author)
Energy and Buildings ; 40 ; 1765-1770
2008-03-09
6 pages
Article (Journal)
Electronic Resource
English
Power consumption benchmark for a semiconductor cleanroom facility system
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