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Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Highlights Impulse pressuring diffusion bonding of Cu alloy to stainless steel was performed. With Ni interlayer, bonding strength reached up to 217.2MPa. Almost plastic fracture was implied by lots of dimples on the fracture surface. Without Ni, the joint with some unbonded zones gave lower tensile strength. Without Ni, failure mode included a ductile pattern and a brittle pattern.
Abstract Impulse pressuring diffusion bonding of a copper alloy to a stainless steel was performed in vacuum. Using Ni interlayer of 12.5μm, the joint produced at 825°C under 5–20MPa for 20min exhibited lower strength, which could result from the insufficient thermal excitation and plastic deformation. At 850°C under 5–20MPa for 5–20min, the strength of the joint improved with time. An optimized joint strength reached up to 217.2MPa. Fracture occurred along the Cu–Ni reaction layer and the Ni layer and almost plastic fracture was confirmed by extensive dimples on the fracture surface. Using the interlayer of 50μm, the fracture surface was similar. Without Ni assistance, under the same bonding condition, the joint strength was about 174.2MPa. The lowered strength might be attributed to the appearance of some unbonded zones in the joint. Lots of brittle fracture areas appeared on the fracture surface.
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Highlights Impulse pressuring diffusion bonding of Cu alloy to stainless steel was performed. With Ni interlayer, bonding strength reached up to 217.2MPa. Almost plastic fracture was implied by lots of dimples on the fracture surface. Without Ni, the joint with some unbonded zones gave lower tensile strength. Without Ni, failure mode included a ductile pattern and a brittle pattern.
Abstract Impulse pressuring diffusion bonding of a copper alloy to a stainless steel was performed in vacuum. Using Ni interlayer of 12.5μm, the joint produced at 825°C under 5–20MPa for 20min exhibited lower strength, which could result from the insufficient thermal excitation and plastic deformation. At 850°C under 5–20MPa for 5–20min, the strength of the joint improved with time. An optimized joint strength reached up to 217.2MPa. Fracture occurred along the Cu–Ni reaction layer and the Ni layer and almost plastic fracture was confirmed by extensive dimples on the fracture surface. Using the interlayer of 50μm, the fracture surface was similar. Without Ni assistance, under the same bonding condition, the joint strength was about 174.2MPa. The lowered strength might be attributed to the appearance of some unbonded zones in the joint. Lots of brittle fracture areas appeared on the fracture surface.
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Yuan, Xinjian (author) / Tang, Kunlun (author) / Deng, Yongqiang (author) / Luo, Jun (author) / Sheng, Guangmin (author)
2013-05-17
8 pages
Article (Journal)
Electronic Resource
English
| British Library Online Contents | 2013
| British Library Online Contents | 2013
| British Library Online Contents | 2013
| British Library Online Contents | 2013
Impulse pressuring diffusion bonding of titanium to 304 stainless steel using pure Ni interlayer
| British Library Online Contents | 2016