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    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    New search for: Yuan, X.
    New search for: Tang, K.
    New search for: Deng, Y.
    New search for: Luo, J.
    New search for: Sheng, G.

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    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    New search for: Yuan, X.
    New search for: Tang, K.
    New search for: Deng, Y.
    New search for: Luo, J.
    New search for: Sheng, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    New search for: Yuan, X.
    New search for: Tang, K.
    New search for: Deng, Y.
    New search for: Luo, J.
    New search for: Sheng, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    Contributors:

    Yuan, X. (author) / Tang, K. (author) / Deng, Y. (author) / Luo, J. (author) / Sheng, G. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 52 ; 359-366

    Publication date:

    2013-01-01

    Size:

    8 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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