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Wetting properties and interfacial microstructures of Sn–Zn–xGa solders on Cu substrate
AbstractThe wetting properties and interfacial microstructures of Sn–9Zn–xGa lead-free solders with Cu substrate were investigated. The wetting property is improved remarkably with the increase of Ga content in the Sn–9Zn lead-free solder. The lower surface tension, which results from the decrease of the oxidation of the Zn atoms owing to the formation of the Ga-rich protective film covered on the liquid solder, is the key reason for the better wettability. During soldering, the Cu5Zn8 compounds layer form at the interface of Sn–9Zn/Cu and the IMCs formed at the solder/Cu surface become much thicker when the Ga content is from 0.1wt.% to 3wt.%. However, neither Cu–Sn compounds nor Ga-rich phases are observed at the solder/Cu surface.
Wetting properties and interfacial microstructures of Sn–Zn–xGa solders on Cu substrate
AbstractThe wetting properties and interfacial microstructures of Sn–9Zn–xGa lead-free solders with Cu substrate were investigated. The wetting property is improved remarkably with the increase of Ga content in the Sn–9Zn lead-free solder. The lower surface tension, which results from the decrease of the oxidation of the Zn atoms owing to the formation of the Ga-rich protective film covered on the liquid solder, is the key reason for the better wettability. During soldering, the Cu5Zn8 compounds layer form at the interface of Sn–9Zn/Cu and the IMCs formed at the solder/Cu surface become much thicker when the Ga content is from 0.1wt.% to 3wt.%. However, neither Cu–Sn compounds nor Ga-rich phases are observed at the solder/Cu surface.
Wetting properties and interfacial microstructures of Sn–Zn–xGa solders on Cu substrate
Chen, WenXue (author) / Xue, SongBai (author) / Wang, Hui (author)
2009-10-23
5 pages
Article (Journal)
Electronic Resource
English
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