A platform for research: civil engineering, architecture and urbanism
INSULATION MATERIAL ARRANGEMENT
An insulating material arrangement 10 is disclosed for insulating a building structure 50 such as a wall 52. The material arrangement 10 includes a planar backing layer 12, a planar adhesive layer 14 (co-planar with the backing layer 12) and a planar phase change material ("PCM") layer 16 which is arranged between the backing layer 12 and the adhesive layer 14, and is also co-planar therewith. The adhesive layer 14 is adapted to secure the material arrangement 10 to the structure in a fitted condition in which the adhesive layer 14 is contacted with the building structure 50. The PCM layer 16 is formed of a silicone foam polymer that is impregnated in some embodiments with micro-encapsulated phase change material in the form of beads, shells or granules 110, and in another arrangement, the PCM layer can also comprise a silicone foam polymer that is impregnated with a phase change material which is absorbed into an amount of porous, inorganic, finely-sized particulate solids (a so-called "bound PCM").
INSULATION MATERIAL ARRANGEMENT
An insulating material arrangement 10 is disclosed for insulating a building structure 50 such as a wall 52. The material arrangement 10 includes a planar backing layer 12, a planar adhesive layer 14 (co-planar with the backing layer 12) and a planar phase change material ("PCM") layer 16 which is arranged between the backing layer 12 and the adhesive layer 14, and is also co-planar therewith. The adhesive layer 14 is adapted to secure the material arrangement 10 to the structure in a fitted condition in which the adhesive layer 14 is contacted with the building structure 50. The PCM layer 16 is formed of a silicone foam polymer that is impregnated in some embodiments with micro-encapsulated phase change material in the form of beads, shells or granules 110, and in another arrangement, the PCM layer can also comprise a silicone foam polymer that is impregnated with a phase change material which is absorbed into an amount of porous, inorganic, finely-sized particulate solids (a so-called "bound PCM").
INSULATION MATERIAL ARRANGEMENT
SCHMETZER BRETT ANTHONY (author) / SCHMETZER STEVEN JOHN (author)
2022-11-24
Patent
Electronic Resource
English
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
A62C
FIRE-FIGHTING
,
Feuerbekämpfung
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden