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Insulation Material Arrangement
An insulating material arrangement (10) is disclosed for insulating a building structure (50) such as a wall (52). The material arrangement (10) includes a planar backing layer (12), a planar adhesive layer (14) co-planar with the backing layer (12) and a planar phase change material (“PCM”) layer (16) which is arranged between the backing layer (12) and the adhesive layer (14), and is also co-planar therewith. The adhesive layer (14) is adapted to secure the material arrangement (10) to the structure in a fitted condition in which the adhesive layer (14) is contacted with the building structure (50). The PCM layer (16) is formed of a silicone foam polymer that is impregnated in some embodiments with micro-encapsulated phase change material in the form of beads, shells or granules (110), and in another arrangement, the PCM layer can also comprise a silicone foam polymer that is impregnated with a phase change material which is absorbed into an amount of porous, inorganic, finely-sized particulate solids (a so-called “bound PCM”).
Insulation Material Arrangement
An insulating material arrangement (10) is disclosed for insulating a building structure (50) such as a wall (52). The material arrangement (10) includes a planar backing layer (12), a planar adhesive layer (14) co-planar with the backing layer (12) and a planar phase change material (“PCM”) layer (16) which is arranged between the backing layer (12) and the adhesive layer (14), and is also co-planar therewith. The adhesive layer (14) is adapted to secure the material arrangement (10) to the structure in a fitted condition in which the adhesive layer (14) is contacted with the building structure (50). The PCM layer (16) is formed of a silicone foam polymer that is impregnated in some embodiments with micro-encapsulated phase change material in the form of beads, shells or granules (110), and in another arrangement, the PCM layer can also comprise a silicone foam polymer that is impregnated with a phase change material which is absorbed into an amount of porous, inorganic, finely-sized particulate solids (a so-called “bound PCM”).
Insulation Material Arrangement
SCHMETZER BRETT ANTHONY (author) / SCHMETZER STEVEN JOHN (author)
2019-05-23
Patent
Electronic Resource
English
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C09J
ADHESIVES
,
Klebstoffe
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
F28D
Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen
,
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT