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Adhesive, organic ceramic plate and preparation method of organic ceramic plate
The invention provides an adhesive, an organic ceramic plate and a preparation method of the organic ceramic plate. The adhesive comprises the following components in percentage by mass: 10-30% of epoxy resin, 10-30% of thermosetting phenol formaldehyde resin, 3-5% of latent curing agent, 0.5-1% of epoxy resin curing accelerator, 10-30% of inorganic filler, 10-20% of toughener, 0.5-2% of thixotropic agent, 0.5-2% of silane coupling agent and 35-45% of diluting solvent. When the adhesive is used in an organic ceramic plate preparation process, the adhesive and ceramic powder can be precured into a solid at low temperature (generally 50-80 DEG C), and pulverized into granules, thereby ensuring the smooth proceeding of the hot pressing of the organic ceramic plate. In the curing process of the plate subjected to hot pressing, the latent curing agent and epoxy resin curing accelerator can quickly cure the epoxy resin in a short time, thereby ensuring the formation of the organic ceramic plate and enhancing the performance of the formed organic ceramic plate.
Adhesive, organic ceramic plate and preparation method of organic ceramic plate
The invention provides an adhesive, an organic ceramic plate and a preparation method of the organic ceramic plate. The adhesive comprises the following components in percentage by mass: 10-30% of epoxy resin, 10-30% of thermosetting phenol formaldehyde resin, 3-5% of latent curing agent, 0.5-1% of epoxy resin curing accelerator, 10-30% of inorganic filler, 10-20% of toughener, 0.5-2% of thixotropic agent, 0.5-2% of silane coupling agent and 35-45% of diluting solvent. When the adhesive is used in an organic ceramic plate preparation process, the adhesive and ceramic powder can be precured into a solid at low temperature (generally 50-80 DEG C), and pulverized into granules, thereby ensuring the smooth proceeding of the hot pressing of the organic ceramic plate. In the curing process of the plate subjected to hot pressing, the latent curing agent and epoxy resin curing accelerator can quickly cure the epoxy resin in a short time, thereby ensuring the formation of the organic ceramic plate and enhancing the performance of the formed organic ceramic plate.
Adhesive, organic ceramic plate and preparation method of organic ceramic plate
WANG ZHIHU (author) / WANG QINGJIE (author) / SUN FANG (author) / ZHONG HUAYU (author)
2015-06-10
Patent
Electronic Resource
English
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C04B
Kalk
,
LIME
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesÃĪttigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
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