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Composition containing ceramic polishing slurry, and application thereof in preparation of ceramic polishing slurry non-fired and non-steam brick
The invention discloses a composition containing ceramic polishing slurry, which comprises: dried ceramic polishing slurry powder, stone chips and an activity exciting agent. The dried ceramic polishing slurry powder is 0.1-15 [mu]m in granularity and is larger than 460 m<2>/kg in specific surface area. The stone chips are 10 mm in maximum granular size and are composed of the stone chips being 5-10 mm in granular size, the stone chips being less than 5 mm in granular size, and the stone chips being less than 1.25 mm in granular size. The activity exciting agent includes an alkaline exciting material and a surfactant, wherein the alkaline exciting material includes one or more from following groups: clinker, phosphorus slag, ore slag, phosphogypsum, alunite, sodium silicate and quick lime; and the surfactant includes one or more from the following groups: naphthalenesulfonate formaldehyde condensation compound, triethanolamine and calcium lignosulphonates. The composition containing ceramic polishing slurry is applied in preparation of the ceramic polishing slurry non-fired and non-steam brick. The ceramic polishing slurry non-fired and non-steam brick is higher than MU15 grade, is free of high-temperature sintering and steam curing, is low in cost and energy consumption and is free of secondary environmental pollution.
Composition containing ceramic polishing slurry, and application thereof in preparation of ceramic polishing slurry non-fired and non-steam brick
The invention discloses a composition containing ceramic polishing slurry, which comprises: dried ceramic polishing slurry powder, stone chips and an activity exciting agent. The dried ceramic polishing slurry powder is 0.1-15 [mu]m in granularity and is larger than 460 m<2>/kg in specific surface area. The stone chips are 10 mm in maximum granular size and are composed of the stone chips being 5-10 mm in granular size, the stone chips being less than 5 mm in granular size, and the stone chips being less than 1.25 mm in granular size. The activity exciting agent includes an alkaline exciting material and a surfactant, wherein the alkaline exciting material includes one or more from following groups: clinker, phosphorus slag, ore slag, phosphogypsum, alunite, sodium silicate and quick lime; and the surfactant includes one or more from the following groups: naphthalenesulfonate formaldehyde condensation compound, triethanolamine and calcium lignosulphonates. The composition containing ceramic polishing slurry is applied in preparation of the ceramic polishing slurry non-fired and non-steam brick. The ceramic polishing slurry non-fired and non-steam brick is higher than MU15 grade, is free of high-temperature sintering and steam curing, is low in cost and energy consumption and is free of secondary environmental pollution.
Composition containing ceramic polishing slurry, and application thereof in preparation of ceramic polishing slurry non-fired and non-steam brick
HUANG XUQUAN (author) / BIE SHUANGQIAO (author) / LIU YUJIE (author) / YANG CHENGFENG (author) / GAN TIAN (author)
2015-07-08
Patent
Electronic Resource
English
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