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High-temperature co-fired ceramic metallization slurry and preparation method thereof
The invention relates to the technical field of electronic materials, in particular to high-temperature co-fired ceramic metallization slurry and a preparation method thereof.The metallization slurry is composed of a metal phase, a high-temperature binding phase, a slurry solvent, a flatting agent and a low-temperature adhesive and can be directly coated on an aluminum oxide or aluminum nitride ceramic green ceramic chip through silk-screen printing or other coating processes; the method comprises the following steps: preparing a metallized ceramic chip from a raw ceramic chip, co-firing the metallized ceramic chip and the raw ceramic chip in a protective atmosphere to obtain a ceramic cooked chip with a metallized surface, and enabling a metallized layer to be well infiltrated with a silver brazing material at 1000 DEG C and to be well infiltrated with a silver-copper brazing material at 780 DEG C, so as to obtain a good brazing binding force and better meet the requirements of a brazing process; according to the preparation method, the technological process is simple, preparation is easy, in the preparation process, the ink solvent is added in three times, so that the auxiliaries and the powder are better dissolved and mixed, and the performance of the finally prepared slurry is ensured.
本发明涉及电子材料技术领域，具体涉及一种高温共烧陶瓷金属化浆料及其制备方法，该金属化浆料由金属相、高温结合相、浆料溶剂、流平剂和低温粘接剂组成，可采用丝网印刷或其他涂覆工艺直接涂覆于氧化铝或氮化铝陶瓷生瓷片，并与生瓷片一同在保护气氛下共烧制得表面附着金属化的陶瓷熟片，金属化层可与银钎焊料在1000℃良好浸润，与银铜钎焊料在780℃良好浸润，从而获得良好的钎焊结合力，以更好地满足钎焊工艺需求；本申请提供的制备方法，工艺流程简单，制备容易，在制备过程中，分三次将油墨溶剂加入，以实现助剂与粉体更好的溶解与混合，确保最终制备的浆料的性能。
High-temperature co-fired ceramic metallization slurry and preparation method thereof
The invention relates to the technical field of electronic materials, in particular to high-temperature co-fired ceramic metallization slurry and a preparation method thereof.The metallization slurry is composed of a metal phase, a high-temperature binding phase, a slurry solvent, a flatting agent and a low-temperature adhesive and can be directly coated on an aluminum oxide or aluminum nitride ceramic green ceramic chip through silk-screen printing or other coating processes; the method comprises the following steps: preparing a metallized ceramic chip from a raw ceramic chip, co-firing the metallized ceramic chip and the raw ceramic chip in a protective atmosphere to obtain a ceramic cooked chip with a metallized surface, and enabling a metallized layer to be well infiltrated with a silver brazing material at 1000 DEG C and to be well infiltrated with a silver-copper brazing material at 780 DEG C, so as to obtain a good brazing binding force and better meet the requirements of a brazing process; according to the preparation method, the technological process is simple, preparation is easy, in the preparation process, the ink solvent is added in three times, so that the auxiliaries and the powder are better dissolved and mixed, and the performance of the finally prepared slurry is ensured.
本发明涉及电子材料技术领域，具体涉及一种高温共烧陶瓷金属化浆料及其制备方法，该金属化浆料由金属相、高温结合相、浆料溶剂、流平剂和低温粘接剂组成，可采用丝网印刷或其他涂覆工艺直接涂覆于氧化铝或氮化铝陶瓷生瓷片，并与生瓷片一同在保护气氛下共烧制得表面附着金属化的陶瓷熟片，金属化层可与银钎焊料在1000℃良好浸润，与银铜钎焊料在780℃良好浸润，从而获得良好的钎焊结合力，以更好地满足钎焊工艺需求；本申请提供的制备方法，工艺流程简单，制备容易，在制备过程中，分三次将油墨溶剂加入，以实现助剂与粉体更好的溶解与混合，确保最终制备的浆料的性能。
High-temperature co-fired ceramic metallization slurry and preparation method thereof
一种高温共烧陶瓷金属化浆料及其制备方法
XIAO WEIFENG (author) / HUANG TAO (author)
2024-05-28
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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