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Insulating ceramic paste, ceramic electronic component and method for producing same
The invention provides an insulating ceramic paste which is capable of preventing short circuits caused by a solder between terminal electrodes that are arranged at a narrow pitch, and which is also capable of suppressing the occurrence of cracks in an insulating body that partially covers the terminal electrodes during a firing process; a ceramic electronic component; and a method for producing a ceramic electronic component. This ceramic electronic component is provided with: a ceramic multilayer substrate (50); terminal electrodes (32a, 33a) that are formed on the surface of the ceramic multilayer substrate (50); and an insulating ceramic film (34) that is formed on the surface of the ceramic multilayer substrate (50) so as to partially cover the terminal electrodes (32a, 33a). The surface exposed portion (a celsian crystal-rich layer) (34a) of the insulating ceramic film (34) has a thermal expansion coefficient lower than that of the ceramic multilayer substrate (50).
Insulating ceramic paste, ceramic electronic component and method for producing same
The invention provides an insulating ceramic paste which is capable of preventing short circuits caused by a solder between terminal electrodes that are arranged at a narrow pitch, and which is also capable of suppressing the occurrence of cracks in an insulating body that partially covers the terminal electrodes during a firing process; a ceramic electronic component; and a method for producing a ceramic electronic component. This ceramic electronic component is provided with: a ceramic multilayer substrate (50); terminal electrodes (32a, 33a) that are formed on the surface of the ceramic multilayer substrate (50); and an insulating ceramic film (34) that is formed on the surface of the ceramic multilayer substrate (50) so as to partially cover the terminal electrodes (32a, 33a). The surface exposed portion (a celsian crystal-rich layer) (34a) of the insulating ceramic film (34) has a thermal expansion coefficient lower than that of the ceramic multilayer substrate (50).
Insulating ceramic paste, ceramic electronic component and method for producing same
WAKAKI SUMIYO (author) / SUMI TAKAHIRO (author) / OKA TAKAHIRO (author)
2015-11-11
Patent
Electronic Resource
English
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