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Low thermal-conductivity high temperature glue and preparation method thereof
The invention belongs to the technical field of refractory materials, and particularly discloses low thermal-conductivity high temperature glue and a preparation method thereof. The low thermal-conductivity high temperature glue is prepared by synthetic mullite with the particle size being less than 0.074mm, alumina micro powder with the particle size being less than 0.074mm, silica powder with the particle size being less than 0.045mm, nano-ATO with the particle size being less than 20nm, and silica sol according to the mass percent. The preparation method comprises the following steps of co-grinding the synthetic mullite, the alumina micro powder, the silica powder and the nano-ATO until the average particle size is less than 0.02mm, emitting, and then adding the silica sol to stir uniformly. The product provided by the invention can be used for binding metal and metal, nonmetal and nonmetal, metal and nonmetal materials within the temperature of 800 to 1600 DEG C, and is wide in application range. The product uses the synthetic mullite as main raw materials, so that the heat conductivity coefficient of the product can be greatly reduced; meanwhile, the added nano-ATO powder body and the silica sol are melted at high temperature to form nanoscale sealed pores, so that the heat conductivity coefficient of the product is further reduced; the product has a high-temperature binding function, meanwhile, the heat insulation effect is obvious, and the energy-saving and consumption-reducing effect is improved.
Low thermal-conductivity high temperature glue and preparation method thereof
The invention belongs to the technical field of refractory materials, and particularly discloses low thermal-conductivity high temperature glue and a preparation method thereof. The low thermal-conductivity high temperature glue is prepared by synthetic mullite with the particle size being less than 0.074mm, alumina micro powder with the particle size being less than 0.074mm, silica powder with the particle size being less than 0.045mm, nano-ATO with the particle size being less than 20nm, and silica sol according to the mass percent. The preparation method comprises the following steps of co-grinding the synthetic mullite, the alumina micro powder, the silica powder and the nano-ATO until the average particle size is less than 0.02mm, emitting, and then adding the silica sol to stir uniformly. The product provided by the invention can be used for binding metal and metal, nonmetal and nonmetal, metal and nonmetal materials within the temperature of 800 to 1600 DEG C, and is wide in application range. The product uses the synthetic mullite as main raw materials, so that the heat conductivity coefficient of the product can be greatly reduced; meanwhile, the added nano-ATO powder body and the silica sol are melted at high temperature to form nanoscale sealed pores, so that the heat conductivity coefficient of the product is further reduced; the product has a high-temperature binding function, meanwhile, the heat insulation effect is obvious, and the energy-saving and consumption-reducing effect is improved.
Low thermal-conductivity high temperature glue and preparation method thereof
YUAN LIN (author) / LI QUANYOU (author) / LI YUANJIN (author) / CAO WEI (author) / ZHENG JIANLI (author)
2015-12-23
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
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