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A platform for research: civil engineering, architecture and urbanism
Preparation method for heat dissipation material used for chip, heat dissipation material used for chip, heat dissipation chip and application
The invention provides a preparation method for a heat dissipation material used for a chip, the heat dissipation material used for the chip, a heat dissipation chip and an application. The preparation method comprises the steps of: preparing an aluminum source and a carbon source into a mixed raw material solution, and sequentially subjecting the mixed raw material solution to heating, pre-sintering and nitriding so as to obtain the heat dissipation material. By adoption of the preparation method provided by the invention, the heat dissipation material with high heat conductivity coefficientcan be prepared; the heat dissipation material has the effects of heat conduction, heat storage and heat slow release; the heat dissipation effect of the heat dissipation material on the chip is good;the heat stability of the heat dissipation material is good; and when the heat dissipation material is used as the heat dissipation material attached to the chip, the heat dissipation capacity of thechip can be greatly improved, and the working temperature of an electronic equipment chip can be made to be within a limit value, so the situation that the use function and the operation stability ofa product are affected due to the fact that the temperature of the chip is over high is avoided; and the user experience is improved.
本发明提供了一种芯片用散热材料的制备方法、芯片用散热材料、散热芯片及应用，所述制备方法包括：铝源和碳源配制成混合原料液，混合原料液依次经加热、预烧和氮化后得到所述散热材料。采用本发明提供的制备方法可以制备得到高导热系数的散热材料，该散热材料具有导热、蓄热及缓释热量的作用，对芯片的散热效果佳且热稳定性好，以此材料作为与芯片相贴合的散热材料可大幅提高芯片的散热能力，可以使电子设备芯片的工作温度在限定值内，从而避免了因芯片温度过高影响产品的使用功能和运行稳定性，进而提高用户体验。
Preparation method for heat dissipation material used for chip, heat dissipation material used for chip, heat dissipation chip and application
The invention provides a preparation method for a heat dissipation material used for a chip, the heat dissipation material used for the chip, a heat dissipation chip and an application. The preparation method comprises the steps of: preparing an aluminum source and a carbon source into a mixed raw material solution, and sequentially subjecting the mixed raw material solution to heating, pre-sintering and nitriding so as to obtain the heat dissipation material. By adoption of the preparation method provided by the invention, the heat dissipation material with high heat conductivity coefficientcan be prepared; the heat dissipation material has the effects of heat conduction, heat storage and heat slow release; the heat dissipation effect of the heat dissipation material on the chip is good;the heat stability of the heat dissipation material is good; and when the heat dissipation material is used as the heat dissipation material attached to the chip, the heat dissipation capacity of thechip can be greatly improved, and the working temperature of an electronic equipment chip can be made to be within a limit value, so the situation that the use function and the operation stability ofa product are affected due to the fact that the temperature of the chip is over high is avoided; and the user experience is improved.
本发明提供了一种芯片用散热材料的制备方法、芯片用散热材料、散热芯片及应用，所述制备方法包括：铝源和碳源配制成混合原料液，混合原料液依次经加热、预烧和氮化后得到所述散热材料。采用本发明提供的制备方法可以制备得到高导热系数的散热材料，该散热材料具有导热、蓄热及缓释热量的作用，对芯片的散热效果佳且热稳定性好，以此材料作为与芯片相贴合的散热材料可大幅提高芯片的散热能力，可以使电子设备芯片的工作温度在限定值内，从而避免了因芯片温度过高影响产品的使用功能和运行稳定性，进而提高用户体验。
Preparation method for heat dissipation material used for chip, heat dissipation material used for chip, heat dissipation chip and application
一种芯片用散热材料的制备方法、芯片用散热材料、散热芯片及应用
ZHANG ZHEN (author)
2020-06-19
Patent
Electronic Resource
Chinese
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