A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Minimally invasive repair method for waterproof layer of bottom plate of basement
The invention discloses two minimally invasive repair methods for a waterproof layer of a bottom plate of a basement. The method comprises the following steps: (1) two or four rows of grouting holes penetrating through the bottom plate are vertically and downwards symmetrically drilled at two sides of a water leakage position, or a plurality of rows of grouting holes penetrating through the bottomplate are vertically and uniformly drilled in the whole bottom plate, the row spacing is 1000 mm, and the hole spacing is 1000 mm; (2) high-pressure grouting pipes are buried in all the grouting holes, and the front ends of the high-pressure grouting pipes reach between an original waterproof layer and the bottom plate; (3) acrylate grouting materials are poured into the gap between the waterproof layer and the bottom plate; (4) the high-pressure grouting pipes are drawn out, and the grouting holes are filled densely; (5) after the bottom plate is no longer water-leaking, cracks are filled byadopting structural pouring sealants, and if local water leakage exists at the bottom plate, the multiple grouting holes penetrating through the bottom plate are vertically and uniformly drilled in the water leakage position, the grouting holes are staggered with the previous grouting holes, and the new grouting holes are constructed according to the same operation. The method has the advantagesthat the basement does not need to carry out precipitation and the operation is simple and convenient.
本发明公开了两种地下室底板防水层的微创修复方法，包括以下步骤：(1)在漏水位置两侧竖直向下对称钻两或四排穿透底板的注浆孔，或在整个底板上竖直向下均匀钻多排穿透底板的注浆孔，排间距1000mm，孔间距1000mm；(2)全部注浆孔中埋入高压注浆管，高压注浆管的前端到达原有防水层与底板之间；(3)将丙烯酸盐灌浆料注入防水层与底板之间的空隙中；(4)拔出高压注浆管，将注浆孔灌注密实；(5)底板不再漏水后，采用结构灌缝胶对裂缝灌缝，如果底板还存在局部漏水，则在漏水位置竖直向下均匀钻多排穿透底板的注浆孔，与之前的注浆孔交错排列，按相同操作对新注浆孔施工。本发明的有益之处在于：无需对地下室进行降水并且操作简便。
Minimally invasive repair method for waterproof layer of bottom plate of basement
The invention discloses two minimally invasive repair methods for a waterproof layer of a bottom plate of a basement. The method comprises the following steps: (1) two or four rows of grouting holes penetrating through the bottom plate are vertically and downwards symmetrically drilled at two sides of a water leakage position, or a plurality of rows of grouting holes penetrating through the bottomplate are vertically and uniformly drilled in the whole bottom plate, the row spacing is 1000 mm, and the hole spacing is 1000 mm; (2) high-pressure grouting pipes are buried in all the grouting holes, and the front ends of the high-pressure grouting pipes reach between an original waterproof layer and the bottom plate; (3) acrylate grouting materials are poured into the gap between the waterproof layer and the bottom plate; (4) the high-pressure grouting pipes are drawn out, and the grouting holes are filled densely; (5) after the bottom plate is no longer water-leaking, cracks are filled byadopting structural pouring sealants, and if local water leakage exists at the bottom plate, the multiple grouting holes penetrating through the bottom plate are vertically and uniformly drilled in the water leakage position, the grouting holes are staggered with the previous grouting holes, and the new grouting holes are constructed according to the same operation. The method has the advantagesthat the basement does not need to carry out precipitation and the operation is simple and convenient.
本发明公开了两种地下室底板防水层的微创修复方法，包括以下步骤：(1)在漏水位置两侧竖直向下对称钻两或四排穿透底板的注浆孔，或在整个底板上竖直向下均匀钻多排穿透底板的注浆孔，排间距1000mm，孔间距1000mm；(2)全部注浆孔中埋入高压注浆管，高压注浆管的前端到达原有防水层与底板之间；(3)将丙烯酸盐灌浆料注入防水层与底板之间的空隙中；(4)拔出高压注浆管，将注浆孔灌注密实；(5)底板不再漏水后，采用结构灌缝胶对裂缝灌缝，如果底板还存在局部漏水，则在漏水位置竖直向下均匀钻多排穿透底板的注浆孔，与之前的注浆孔交错排列，按相同操作对新注浆孔施工。本发明的有益之处在于：无需对地下室进行降水并且操作简便。
Minimally invasive repair method for waterproof layer of bottom plate of basement
地下室底板防水层的微创修复方法
BIAN ZHAOWEI (author) / TIAN PENGGANG (author) / ZHANG FENGLIANG (author) / YUN ZUOYI (author) / LIU SUIQIANG (author) / CHENG HAO (author) / MAO DONGXU (author) / CHEN LIYING (author)
2020-06-30
Patent
Electronic Resource
Chinese
IPC:
E02D
FOUNDATIONS
,
Gründungen
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