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Preparation method of boron nitride composite structure filler for interface heat-conducting material
The invention relates to a preparation technology of an interface heat-conducting material, and aims to provide a preparation method of a boron nitride composite structure filler for the interface heat-conducting material. The preparation method comprises the following steps: performing hydrophilic treatment on boron nitride powder with a sodium hydroxide solution; adding the treated boron nitridepowder into a metal inorganic salt aqueous solution, and stirring at normal temperature; filtering but not cleaning, putting wet powder into a tube furnace, and sintering in an oxygen atmosphere to obtain powder, namely the boron nitride composite structure filler. According to the invention, rod-like metal oxide particles grow between boron nitride sheets, so that the number of efficient heat-conducting channels between the boron nitride sheets is increased, the interface heat resistance of the whole system filler is reduced, and the heat-conducting coefficient is increased. And the low dielectric constant of silicone oil can be better utilized on the premise of ensuring the heat conductivity coefficient, so that the dielectric constant of the final heat-conducting material is less than4. Raw materials are easy to obtain, the preparation process is simple, cost is low, and the method can be applied to large-scale industrial production.
本发明涉及界面导热材料的制备技术，旨在提供一种用于界面导热材料的氮化硼复合结构填料的制备方法。包括：将氮化硼粉体以氢氧化钠溶液进行亲水性处理；处理后的氮化硼粉末加入金属无机盐水溶液，常温下搅拌；过滤但不清洗，潮湿粉体放入管式炉中，在氧气气氛下烧结，得到的粉体即氮化硼复合结构填料。本发明通过在氮化硼片间生长出棒状的金属氧化物颗粒，提升了氮化硼片与片之间的高效导热通路数量，降低了整个体系填料的界面热阻，提升了导热系数。能在保证导热系数的前提下较好的利用了硅油的低介电常数，使得最终的导热材料的介电常数小于4。本发明原料易获得、制备工艺简单、成本低，可以应用于大规模工业化生产。
Preparation method of boron nitride composite structure filler for interface heat-conducting material
The invention relates to a preparation technology of an interface heat-conducting material, and aims to provide a preparation method of a boron nitride composite structure filler for the interface heat-conducting material. The preparation method comprises the following steps: performing hydrophilic treatment on boron nitride powder with a sodium hydroxide solution; adding the treated boron nitridepowder into a metal inorganic salt aqueous solution, and stirring at normal temperature; filtering but not cleaning, putting wet powder into a tube furnace, and sintering in an oxygen atmosphere to obtain powder, namely the boron nitride composite structure filler. According to the invention, rod-like metal oxide particles grow between boron nitride sheets, so that the number of efficient heat-conducting channels between the boron nitride sheets is increased, the interface heat resistance of the whole system filler is reduced, and the heat-conducting coefficient is increased. And the low dielectric constant of silicone oil can be better utilized on the premise of ensuring the heat conductivity coefficient, so that the dielectric constant of the final heat-conducting material is less than4. Raw materials are easy to obtain, the preparation process is simple, cost is low, and the method can be applied to large-scale industrial production.
本发明涉及界面导热材料的制备技术，旨在提供一种用于界面导热材料的氮化硼复合结构填料的制备方法。包括：将氮化硼粉体以氢氧化钠溶液进行亲水性处理；处理后的氮化硼粉末加入金属无机盐水溶液，常温下搅拌；过滤但不清洗，潮湿粉体放入管式炉中，在氧气气氛下烧结，得到的粉体即氮化硼复合结构填料。本发明通过在氮化硼片间生长出棒状的金属氧化物颗粒，提升了氮化硼片与片之间的高效导热通路数量，降低了整个体系填料的界面热阻，提升了导热系数。能在保证导热系数的前提下较好的利用了硅油的低介电常数，使得最终的导热材料的介电常数小于4。本发明原料易获得、制备工艺简单、成本低，可以应用于大规模工业化生产。
Preparation method of boron nitride composite structure filler for interface heat-conducting material
用于界面导热材料的氮化硼复合结构填料的制备方法
GAO LING (author) / HUANG KAI (author) / LIU JIANGANG (author)
2020-07-10
Patent
Electronic Resource
Chinese
IPC:
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C04B
Kalk
,
LIME
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
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