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Rapid plasma sintering preparation method of ceramic PCB substrate
The invention relates to a rapid preparation method for preparing a novel ceramic PCB substrate by using a plasma sintering technology (SPS). 2-8 wt.% of copper oxide (CuO or Cu2O) is added into oxideceramics such as aluminum oxide (Al2O3) and zirconium oxide ZrO2-3% Y2O3 (3YSZ) materials, and the Al2O3-copper oxide and ZrO2-3% Y2O3-copper oxide composite material ceramic PCB substrate is prepared at a low temperature through rapid sintering. The method is low in cost, simple in preparation process and short in period. The method is applied to the field of electronic materials and the field of large-scale integrated circuits.
本发明涉及一种利用等离子烧结技术(SPS)制备新型陶瓷PCB基板的快速制备方法。通过在氧化物陶瓷中如氧化铝(Al2O3)，氧化锆ZrO2‑3％Y2O3(3YSZ)材料添加氧化铜(CuO或者Cu2O)2～8wt.％，快速烧结在低温下制备Al2O3‑氧化铜,ZrO2‑3％Y2O3‑氧化铜复合材料陶瓷PCB基板。本发明成本低，制备工艺简单，周期短。本发明应用于电子材料领域和大规模集成电路领域。
Rapid plasma sintering preparation method of ceramic PCB substrate
The invention relates to a rapid preparation method for preparing a novel ceramic PCB substrate by using a plasma sintering technology (SPS). 2-8 wt.% of copper oxide (CuO or Cu2O) is added into oxideceramics such as aluminum oxide (Al2O3) and zirconium oxide ZrO2-3% Y2O3 (3YSZ) materials, and the Al2O3-copper oxide and ZrO2-3% Y2O3-copper oxide composite material ceramic PCB substrate is prepared at a low temperature through rapid sintering. The method is low in cost, simple in preparation process and short in period. The method is applied to the field of electronic materials and the field of large-scale integrated circuits.
本发明涉及一种利用等离子烧结技术(SPS)制备新型陶瓷PCB基板的快速制备方法。通过在氧化物陶瓷中如氧化铝(Al2O3)，氧化锆ZrO2‑3％Y2O3(3YSZ)材料添加氧化铜(CuO或者Cu2O)2～8wt.％，快速烧结在低温下制备Al2O3‑氧化铜,ZrO2‑3％Y2O3‑氧化铜复合材料陶瓷PCB基板。本发明成本低，制备工艺简单，周期短。本发明应用于电子材料领域和大规模集成电路领域。
Rapid plasma sintering preparation method of ceramic PCB substrate
一种陶瓷PCB基板的快速等离子烧结制备方法
BEI GUOPING (author)
2020-08-11
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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