A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Ceramic repairing method
The invention relates to the technical field of ceramic repairing, in particular to a ceramic repairing method. The method comprises the following steps: firstly polishing a defect part; then carryingout sand blasting on the ground part with a micro sand blasting machine; then treating the sand blasted part with a cotton swab dipped in hydrofluoric acid; completely flushing hydrofluoric acid at the part; blow-drying the part; filling the part with a repairing material and compacting; after the repairing material is dried, polishing the repaired part to make the repaired part smoothly transitwith the surrounding ceramic green body and accord with the curved surface profile of the original ceramic green body; glazing the repaired part, and firing the repaired ceramic green body. Accordingto the method disclosed by the invention, the binding force between the repairing material and the ceramic body is strong, so that the ceramic body is not easy to crack during firing; and the surfaceof the repairing material is polished after the repairing material is dried, so that the influence of shrinkage of the repairing material after drying on the surface flatness is avoided, and repairingtraces of a repaired part and an unrepaired part are not obvious.
本发明涉及陶瓷修补技术领域，尤其涉及一种陶瓷修补方法。包括以下步骤：先对缺陷部位进行打磨，之后用微型喷砂机对打磨过的部位进行喷砂，然后用棉签蘸氢氟酸对喷砂部位的表面进行处理，之后将此部位的氢氟酸冲洗干净，吹干水分，之后用修补材料填补在此部位并压实，待修补材料干燥后，对修补部位进行打磨，使其与周围陶瓷坯体光滑过渡并符合原陶瓷坯体的曲面轮廓，然后对修补部位进行施釉，最后将修补好的陶瓷坯体进行烧成。本发明的方法修补材料与陶瓷坯体的结合力强，从而在烧成时不易开裂；在修补材料干燥后再对其表面进行打磨，避免了其干燥后收缩对表面平整度的影响，修补部位与未修补的部位修补痕迹不明显。
Ceramic repairing method
The invention relates to the technical field of ceramic repairing, in particular to a ceramic repairing method. The method comprises the following steps: firstly polishing a defect part; then carryingout sand blasting on the ground part with a micro sand blasting machine; then treating the sand blasted part with a cotton swab dipped in hydrofluoric acid; completely flushing hydrofluoric acid at the part; blow-drying the part; filling the part with a repairing material and compacting; after the repairing material is dried, polishing the repaired part to make the repaired part smoothly transitwith the surrounding ceramic green body and accord with the curved surface profile of the original ceramic green body; glazing the repaired part, and firing the repaired ceramic green body. Accordingto the method disclosed by the invention, the binding force between the repairing material and the ceramic body is strong, so that the ceramic body is not easy to crack during firing; and the surfaceof the repairing material is polished after the repairing material is dried, so that the influence of shrinkage of the repairing material after drying on the surface flatness is avoided, and repairingtraces of a repaired part and an unrepaired part are not obvious.
本发明涉及陶瓷修补技术领域，尤其涉及一种陶瓷修补方法。包括以下步骤：先对缺陷部位进行打磨，之后用微型喷砂机对打磨过的部位进行喷砂，然后用棉签蘸氢氟酸对喷砂部位的表面进行处理，之后将此部位的氢氟酸冲洗干净，吹干水分，之后用修补材料填补在此部位并压实，待修补材料干燥后，对修补部位进行打磨，使其与周围陶瓷坯体光滑过渡并符合原陶瓷坯体的曲面轮廓，然后对修补部位进行施釉，最后将修补好的陶瓷坯体进行烧成。本发明的方法修补材料与陶瓷坯体的结合力强，从而在烧成时不易开裂；在修补材料干燥后再对其表面进行打磨，避免了其干燥后收缩对表面平整度的影响，修补部位与未修补的部位修补痕迹不明显。
Ceramic repairing method
一种陶瓷修补方法
XIA JIANSHI (author) / XIA ZHULI (author) / ZHANG HONGXING (author) / ZHANG LIPING (author)
2020-09-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
B24C
ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
,
Abschleifendes oder ähnliches Abstrahlen mit teilchenförmigem Werkstoff
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
| European Patent Office | 2024
| European Patent Office | 2024
| European Patent Office | 2023