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The invention discloses a 5G mobile phone high-toughness cover plate and a preparation method thereof. The 5G mobile phone high-toughness cover plate is prepared by sintering the following raw materials in parts by weight through a conventional method: 100 parts of zirconium dioxide, 0.3-0.8 part of a borate coupling agent, 1-8 parts of diboron trioxide, 0.5-1.5 parts of zirconium diboride and 0.5-1.5 parts of polyamide. The 5G mobile phone high-toughness cover plate provided by the invention has good bending strength and fracture toughness.
本发明公开了一种5G手机高韧性盖板及其制备方法。所述5G手机高韧性盖板,由下述原料采用常规方法烧结而成:100重量份二氧化锆、0.3‑0.8重量份硼酸酯偶联剂、1‑8重量份三氧化二硼、0.5‑1.5重量份二硼化锆、0.5‑1.5重量份聚酰胺。本发明的5G手机高韧性盖板具有良好抗弯强度和断裂韧性。
The invention discloses a 5G mobile phone high-toughness cover plate and a preparation method thereof. The 5G mobile phone high-toughness cover plate is prepared by sintering the following raw materials in parts by weight through a conventional method: 100 parts of zirconium dioxide, 0.3-0.8 part of a borate coupling agent, 1-8 parts of diboron trioxide, 0.5-1.5 parts of zirconium diboride and 0.5-1.5 parts of polyamide. The 5G mobile phone high-toughness cover plate provided by the invention has good bending strength and fracture toughness.
本发明公开了一种5G手机高韧性盖板及其制备方法。所述5G手机高韧性盖板,由下述原料采用常规方法烧结而成:100重量份二氧化锆、0.3‑0.8重量份硼酸酯偶联剂、1‑8重量份三氧化二硼、0.5‑1.5重量份二硼化锆、0.5‑1.5重量份聚酰胺。本发明的5G手机高韧性盖板具有良好抗弯强度和断裂韧性。
5G mobile phone high-toughness cover plate and preparation method thereof
5G手机高韧性盖板及其制备方法
XU QIANG (author)
2020-11-03
Patent
Electronic Resource
Chinese
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