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The invention discloses a novel filling floor slab, and relates to the technical field of buildings. The floor slab comprises floor slab bodies and profile plates, wherein first grooves used for containing reinforcing steel bars are formed in the length direction of the floor slab bodies, the floor slab bodies are arranged side by side in parallel, any two adjacent floor slab bodies can be detachably connected in a butt joint mode, and at least one through hole is further formed in the length direction of the floor slab bodies, the profile plates are matched with the through holes in a one-to-one correspondence mode, and the profile plates can penetrate through the floor slab bodies. According to the novel filling floor slab, the problems that in the prior art, a building floor is complexin construction process, low in construction efficiency, too large in floor self-weight and high in construction cost are solved.
本发明公开了新型填充楼板,涉及建筑技术领域。包括楼板本体以及型材板,沿楼板本体的长度方向设置有用于供钢筋进行放入的第一凹槽,各个楼板本体平行并排设置,并且任意相邻的两个楼板本体之间能够可拆卸对接,沿楼板本体的长度方向还设置有至少一个通孔,型材板与通孔一一对应配合,并且型材板能够将楼板本体进行贯穿;从而解决了现有技术中建筑楼板的施工工艺复杂、施工效率低下、楼板自重过大以及施工成本高的问题。
The invention discloses a novel filling floor slab, and relates to the technical field of buildings. The floor slab comprises floor slab bodies and profile plates, wherein first grooves used for containing reinforcing steel bars are formed in the length direction of the floor slab bodies, the floor slab bodies are arranged side by side in parallel, any two adjacent floor slab bodies can be detachably connected in a butt joint mode, and at least one through hole is further formed in the length direction of the floor slab bodies, the profile plates are matched with the through holes in a one-to-one correspondence mode, and the profile plates can penetrate through the floor slab bodies. According to the novel filling floor slab, the problems that in the prior art, a building floor is complexin construction process, low in construction efficiency, too large in floor self-weight and high in construction cost are solved.
本发明公开了新型填充楼板,涉及建筑技术领域。包括楼板本体以及型材板,沿楼板本体的长度方向设置有用于供钢筋进行放入的第一凹槽,各个楼板本体平行并排设置,并且任意相邻的两个楼板本体之间能够可拆卸对接,沿楼板本体的长度方向还设置有至少一个通孔,型材板与通孔一一对应配合,并且型材板能够将楼板本体进行贯穿;从而解决了现有技术中建筑楼板的施工工艺复杂、施工效率低下、楼板自重过大以及施工成本高的问题。
Novel filling floor slab
新型填充楼板
2020-12-22
Patent
Electronic Resource
Chinese
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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