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Piezoresistor ceramic chip with centralized current in central area
The invention discloses a piezoresistor ceramic chip with centralized current in a central area, and further discloses a preparation process of the piezoresistor ceramic chip. The piezoresistor ceramic chip is formed by infiltrating the edge with specially-made slurry and then sintering. The preparation method comprises the following steps of: preparing a main material; preparing green body slurry; granulating; preparing a green body; and sintering. When a piezoresistor is impacted by surge current, most of the current in the piezoresistor passes through the central area of the ceramic chip. According to the piezoresistor ceramic chip, on the premise of not reducing the endurance capacity of the piezoresistor ceramic chip, the current borne by the edge area of the piezoresistor ceramic chip is reduced, the failure condition that the edge of the piezoresistor ceramic chip is easy to melt through and burst when the piezoresistor ceramic chip is impacted by the surge current is improved,and meanwhile, when the piezoresistor ceramic chip is applied to an SPD device with a thermal disconnector, the disengagement sensitivity of the device can be effectively improved, and the safety performance of electric appliances is improved.
本发明公开了一种中心区域电流集中的压敏电阻瓷片，还公开了其制备工艺。所述压敏电阻瓷片通过边沿浸润特制浆料后烧结而成。制备步骤分为：制备主料，制备生坯浆料，造粒，生坯制备，烧结。在受到浪涌电流冲击时，所述压敏电阻中的电流将大部分从瓷片的中心区域通过。本发明的优点是在不降低压敏电阻瓷片耐受能力的前提下，减少了压敏电阻瓷片边沿区域承受的电流，改善了压敏电阻瓷片在受到浪涌电流冲击时边沿易熔穿爆裂的失效情况，同时此压敏电阻瓷片在用于带有热脱离器的SPD器件上时，能有效提高器件的脱离敏感性，提高用电器的安全性能。
Piezoresistor ceramic chip with centralized current in central area
The invention discloses a piezoresistor ceramic chip with centralized current in a central area, and further discloses a preparation process of the piezoresistor ceramic chip. The piezoresistor ceramic chip is formed by infiltrating the edge with specially-made slurry and then sintering. The preparation method comprises the following steps of: preparing a main material; preparing green body slurry; granulating; preparing a green body; and sintering. When a piezoresistor is impacted by surge current, most of the current in the piezoresistor passes through the central area of the ceramic chip. According to the piezoresistor ceramic chip, on the premise of not reducing the endurance capacity of the piezoresistor ceramic chip, the current borne by the edge area of the piezoresistor ceramic chip is reduced, the failure condition that the edge of the piezoresistor ceramic chip is easy to melt through and burst when the piezoresistor ceramic chip is impacted by the surge current is improved,and meanwhile, when the piezoresistor ceramic chip is applied to an SPD device with a thermal disconnector, the disengagement sensitivity of the device can be effectively improved, and the safety performance of electric appliances is improved.
本发明公开了一种中心区域电流集中的压敏电阻瓷片，还公开了其制备工艺。所述压敏电阻瓷片通过边沿浸润特制浆料后烧结而成。制备步骤分为：制备主料，制备生坯浆料，造粒，生坯制备，烧结。在受到浪涌电流冲击时，所述压敏电阻中的电流将大部分从瓷片的中心区域通过。本发明的优点是在不降低压敏电阻瓷片耐受能力的前提下，减少了压敏电阻瓷片边沿区域承受的电流，改善了压敏电阻瓷片在受到浪涌电流冲击时边沿易熔穿爆裂的失效情况，同时此压敏电阻瓷片在用于带有热脱离器的SPD器件上时，能有效提高器件的脱离敏感性，提高用电器的安全性能。
Piezoresistor ceramic chip with centralized current in central area
一种中心区域电流集中的压敏电阻瓷片
YE LINLONG (author) / QIN YUANDONG (author) / LIANG ZIWEI (author)
2020-12-25
Patent
Electronic Resource
Chinese
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